Who We Are:

The Strategic Aerospace Department Office of the Director provides guidance and direction to a multi-disciplinary team of engineers that provides cutting edge engineering development services to the USAF.

Objectives of this Role:

• Work with multidisciplinary team of engineers and technicians in the execution of complex R&D aerospace and defense programs.
• Interaction with technical staff, vendors and customers; interpretation of project technical and management data.
• Design complex Printed Circuit Board (PCB) layouts that meet avionics standards.
• Support integration, test, engineering labs, suppliers, production, supply chain, and the build of complex microprocessor based LRU's.

Daily and Monthly Responsibilities:

• Collaborate directly with Systems, Electrical and Mechanical engineers to develop printed circuit boards and interconnect systems in support of MIL-SPEC avionics flight electronic hardware.
• Will work in a team environment as well as independently to complete assigned tasks with direct supervision.
• Responsibilities include development of Printed Circuit Boards (PCBs) and Library component generation. Requires complex PCB design experience.
• Support the orchestration process to design PCBA's, order/manage parts, build and test LRU's.

Requirements:

• Requires a high school diploma or equivalent with continued education, certifications, and experience to include 25 years of professional level experience in printed wiring board design or a Bachelors degree in Electrical/Electronics Engineering Technology or Aeronautics Technology.
• Must have IPC-Certified Interconnect Design (CID) basic.
• CID+ (advanced) certification preferred.
• 6-10 years: Those with a Bachelors degree require advanced working knowledge of Mentor Graphics PADS Professional, and/or Xpedition.
• 25 years : Those without a degree will require an advanced working knowledge of Mentor Graphics PADS Professional, and/or Xpedition.
• Basic understanding of configuration management and electronic development methods are required. A good understanding of Signal Integrity as well as a good mechanical aptitude is desired. Prior knowledge of IPC standards, Digital, Mixed Signal, and RF electronics PWB designs.
• Interconnect principles and practices designing low level and complex PWB designs is beneficial. These include microprocessor and/or RF based PCB's. Experience with 12+ layer board designs expected.
• A valid/clear driver's license is required.